INFIfab will enable the development and translation of magnetically actuated, multifunctional nanobots for biomedical sensing, targeted therapy, and advanced diagnostics, including future integration with quantum-enabled measurements. The program will prioritise biocompatibility, precise control, and scalable manufacturing to enable clinical deployment across applications ranging from dentistry to oncology.

Advanced packaging is the future of the 8 ATMPs and OSATs that are being built with support from the India Semiconductor Mission. Today, they are importing technology. But tomorrow, they will find indigenous solutions that INFIfab will provide. INFIfab will develop critical base technologies such as TSV wafer bonding and interposers. It will also offer prototyping services, allowing ideas and materials to be demonstrated at scale.

INFIFab will establish a pilot-scale MEMS fabrication and packaging line to support rapid prototyping and low-volume production. INFIFab will also advance next-generation MEMS platforms—including piezo-MEMS, wafer-scale packaging, and opto-MEMS—enabling future systems in medical imaging, communications, safety, and optical sensing.

INFIfab will facilitate the development of innovative microfluidic device architectures and high-resolution 3D printing methods to enable large-scale integration and rapid cell screening.

INFIfab will drive the development of multiplexed solid-state nanopore devices capable of simultaneously detecting multiple DNA targets, enabling applications such as liquid biopsy for early cancer detection and rapid classification of infectious diseases.

INFIfab will support the development of bioengineered scaffolds that actively direct neurite growth and promote synaptic integration, along with sub-micron 3D electrode arrays for high-resolution neural sensing.

INFIFab will establish comprehensive prototyping facilities for IR sensors and Micro-LED optoelectronics, providing indigenous, export-control-resilient capabilities accessible to startups and industry.

The National Quantum Mision (NQM) has identified IISc as the hub for Quantum Communication vertical. The central facility for fabricating superconducting and photonic qubit processors will be housed in INFIfab. INFIfab will launch programs to develop architecture and technology for quantum interconnects and quantum memory. It will also develop accessories and systems, to realise a 1000-bit quantum computer, which is the goal of the NQM.

Wide bandgap semiconductors such as GaN and SiC are essential for high-power, high-frequency electronics, enabling major gains in energy efficiency, power density, and system miniaturisation across electric vehicles, data centres, and advanced communications.

IISc is one of the four hubs of the National Quantum Mission. INFIfab will host a central facility for quantum technology with an investment of ₹350 Cr. The IISc quantum hub will fabricate India’s first quantum chip by 2030.

Quantum Research Park (QuRP) at IISc, funded by the Govt of Karnataka supports faculty led R&D initiatives, and provides mentorship and access to equipment clusters for startups.

Wadhwani Innovation Network Center of Excellence (WIN-CoE) for Quantum Technologies at IISc is an initiative by the Wadhwani Charitable Foundation, USA, aimed at driving interdisciplinary research and innovation in Quantum Science & Technologies for real-world solutions.

The Indian Nanoelectronics Users' Program (INUP) funded by the Ministry of Electronics and Information Technology (MeitY) plays a transformative role in strengthening India's nanoelectronics ecosystem by enabling capacity building, fostering innovation, and facilitating research-to-market translation.

The Sensor Technologies for Security Program by DRDO aims to translate high-TRL sensors into deployable systems, advance next-gen sensor R&D aligned with its 20-year roadmap, and bridge gaps hindering tech transfer.

Incubate and mentor microfabrication start-ups from idea to market.

In the areas of next-gen computing, advanced packaging, quantum technologies, photonics, compound semi, and MEMS.

Bridge research and manufacturing by providing testing, prototyping, and benchmarking.

A six storey building with 96,000 sq. ft. of semiconductor lab space.

Develop skilled talent through degree and training programs, ensuring inclusion of disadvantaged groups.

CoSEIn 2026, Date: 19th June 2026

13th Jan 2026

11th Feb 2026

CeNSE 2026, Date: 12th Feb 2026

CeNSE is home to India’s largest 24*7 operational, open to all academic fab facility for nanofabrication, characterisation, and packaging, with ISO 9001:2015, ISO 14001:2015, ISO 45001:2018 certification for quality, safety, and environmental impact.

CeNSE is national facility open to anyone. The access is transparent, fair, and meritocratic, with no "rent-seeking" or hidden barrier. This open access culture is unique to CeNSE and will continue at INFIfab.

CeNSE hosts InCeNSE, a technology business incubator supported by Government of karnataka that supports entrepreneurs and startups focused on deep-tech hardware innovation. InCeNSE is open to start-ups both within and outside IISc. Since its inception in 2019, it has incubated 14 start-ups, providing them with access to CeNSE’s advanced infrastructure and mentoring.

Strategic Sector Connect

CeNSE executed 26 projects worth ₹66 Cr for the strategic sector with10 Transfer of Technology to ISRO and DRDO. CeNSE has also conducted 6 training programs for ISRO and DRDO. Scientists from strategic sector have cumulatively used CeNSE facilities for 4400 hours.

With a motto of `Science to systems to society’, CeNSE emphasises cutting-age scientific exploration and the translation of its discoveries into societal impact. CeNSE faculty has produced 50 patents between 2019 to 2023. CeNSE has 65 technologies on offer from TRL 4 to 9, with 24 tech transfer agreements.

CeNSE faculty has published 408 articles in scientific journals of high repute and 235 articles in conference proceedings during 2019-23. In 2023, the faculty had a cumulative h-index of 445 and an i10 index of 807.

CeNSE conducts 45+ training programs that benefits more than 3800 students, teachers, and industry professionals in a calendar year under MeitY funded INUP program, Ministry of Tribal Affair’s Program, MEA funded ITEC program, NSQF short-term trainings, Industry training programs, Winter/Summer schools, and Akanksha Program.

Professor & Chair
PhD, Brown University

Research Areas:
Nanorobotics, Quantum Fluids, Liquid and Superfluid Helium, Active matter, Nanobiotechnology, Biophysics, Quantum sensing, Plasmonic metamaterials, 2D materials, Optoelectronics

Professor
PhD, University of Maryland,
College Park

Research Areas:
Nanoelectromechanical sensors, Optomechanics, nonlinear dynamics

Assistant Professor
PhD, University of Cambridge

Research Areas:
Nanofabrication, nano-structured materials, optoelectronics, spectroscopy, device engineering, automation

Assistant Professor
PhD, Indian Institute of Science

Research Areas:
Quantum Sensing, Scanning SET of 2D materials, Quantum transport of van der Waals heterostructures, Nanoelectronics, Electron hydrodynamics, Low temperature physics, Moire superlattice

Assistant Professor
PhD, BITS Pilani, Goa Campus

Research Areas:
Molecular Beam Epitaxy, Material Interfaces, Topological Insulators, Superconductors, Magnetic semiconductors

Associate Professor
PhD, Ohio State University

Research Areas:
Wide band gap devices for microwave and power electronics

Assistant Professor
PhD, National Tsing Hua University

Research Areas:
Acoustics, MEMS/NEMS, Inertial Sensors, MEMS/NEMS Nonlinearity, Piezoelectricity, Sensors and Actuators, Systems on chip

Professor
PhD, Purdue University

Research Areas:
Solid-state nanopores, nanopore based single molecule DNA and protein sequencing, single molecule sensing using nanopores

Professor
PhD, Stanford University

Research Areas:
Electrochemical Biosensors, SERS & Lab-on-a-chip devices, Gas sensors, 2D nanoelectronics with MoS2 and Graphene, Al/GaN high electron mobility transistors, novel materials and processes for CMOS & MEMS applications

Associate Professor
PhD, University of Pennsylvania

Research Areas:
Correlated Systems, Ferroic Oxides, in situ electron microscopy and spectroscopy, material networks for neuromorphic materials and networks, phase change materials, thin film x-ray diffraction

Associate Professor
PhD, University of California
Los Angeles

Research Areas:
Microfluidics, Lab-on-chip, Droplets, Interfacial phenomenon in microfluidics, Fluidic sensors, Heterogeneous integration

Professor
PhD, Cornell University

Research Areas:
MEMS/NEMS, MEMS & NEMS Sensors, Vibratory Mechanobiology, Materials for MEMS/NEMS, Fundamental research in NEMS/MEMS, Transduction-targeted material development

Associate Professor
PhD, Stanford University

Research Areas:
MEMS/NEMS fabrication, Materials for MEMS/NEMS, MEMS/NEMS sensors, Study of Energy Loss Mechanisms and Noise in MEMS/NEMS, Phononic crystals, Wafer-scale MEMS Packaging

Associate Professor & Associate Chair
PhD, Ghent University-IMEC

Research Areas:
Silicon Photonic Integrated Circuits, High-speed data communication, Photonics Radar, Optical Sensor, Photonic IC packaging.

Assistant Professor
PhD, National University of Singapore

Research Areas:
Artificial intelligence, Neuromorphic circuits, In-memory computing, Molecular electronics, Nanoelectronics, Nonlinear dynamics and chaos

Professor
PhD, The Pennsylvania State University

Research Areas:
Thin Film growth, nano-structures and bulk crystals, Growth of group IIIA (Ga, In, Al) nitrides, oxides & 2d materials, Stress and defect structure evolution, Effects of stress on crystal properties and device performance.

Associate Professor
PhD, Purdue University

Research Areas:
Photonics, Optical Data/Tele-Communications, Nonlinear Optics in Fibers and Integrated Nanophotonic Devices, Fiber Lasers and Amplifiers, Optical Frequency Combs and Ultrafast Lasers, Optical Signal Processing

Associate Professor
PhD, Princeton University

Research Areas:
Thin-film solar cells, IR photodetectors, thin-film transistors, atomic layer deposition, pulse laser deposition, large-area printable electronics, and advanced optoelectronic characterization